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| MLX80001 4-channel Master LIN Transceiver Features Compliant to LIN Specification Version 1.3, 2.x and J2602 4 channel independent enhanced master transceiver function Slew rate selection for 10.4kbps (J2602) and 20kbps (LIN 2.x) for optimized radiated emission behavior Disable of slew rate control for fast programming or test modes High EMC immunity Fully integrated receiver filter LIN terminals proof against short-circuits and transients in the automotive environment High impedance LIN in case of loss of ground , loss of battery and under voltage condition LIN short to ground protection Control output for voltage regulator Only 25A typical power consumption in sleep mode Remote wake up via LIN traffic Integrated master termination resistors (1kOhm) and decoupling diodes Thermal overload protection 5V and 3.3V compatible digital inputs 20-pin thermally enhanced QFN 5x5 package 4kV ESD protection pin LIN Ordering Information Part No. MLX80001 KLQD Temperature Range K (-40 to 125 C) Package LQD (MLPQ 5x5 20pins) General Description The MLX80001 is a 4 channel physical layer device for applications of low speed vehicle serial data network communication using the Local Interconnect Network (LIN) protocol. The device is designed in accordance to the physical layer definition of the LIN Protocol Specification Package 2.x and the SAE J2602 standard. The IC furthermore can be used in ISO9141 systems. Because of the very low current consumption of the MLX80001 in the recessive state it's suitable for ECU applications with hard standby current requirements. An advanced sleep mode capability allows a shutdown of a complete master node. The included wake-up function detects incoming dominant LIN messages and enables the voltage regulator. MLX80001 - Datasheet 3901080001 Page 1 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver Contents 1. 2. Functional Diagram ....................................................................................................4 Electrical Specification ..............................................................................................5 2.1 2.2 2.3 2.4 2.5 2.6 3. Operating Conditions.............................................................................................5 Absolute Maximum Ratings ...................................................................................6 Static Characteristics.............................................................................................7 Dynamic Characteristics........................................................................................9 Timing Diagrams .................................................................................................10 Test Circuits for Dynamic and Static Characteristics ...........................................12 Functional Description.............................................................................................13 3.1 TxDx Input pin - Logic command to transmit on LINx bus as follows:..................13 3.2 RxDx Output pin - Logic data as sensed on the LINx bus ...................................13 3.3 Mode 0 and Mode 1 pins respectively are used to select transceiver operating modes: ...........................................................................................................................14 3.4 Power on procedure , INH Pin - INHIBIT ............................................................15 3.5 Pin LIN.................................................................................................................16 4. 5. Fail-save Features ....................................................................................................17 Application Hints ......................................................................................................19 5.1 5.2 5.3 Bus loading requirements....................................................................................19 Duty Cycle Calculation ........................................................................................20 Application Circuitry.............................................................................................22 6. 7. 8. 9. 10. 11. Pin Description .........................................................................................................23 Mechanical Specification MLPQ5x5 20...................................................................24 ESD/EMC Remarks ...................................................................................................25 Revision History .......................................................................................................26 Assembly Information ..........................................................................................27 Disclaimer..............................................................................................................28 MLX80001 - Datasheet 3901080001 Page 2 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver List of Figures Figure 1 - Block diagram.......................................................................................................................... 4 Figure 3 - Receiver debouncing and propagation delay....................................................................... 10 Figure 4 - Sleep mode and wake up procedure .................................................................................... 11 Figure 5 - Test circuit for dynamic characteristics ................................................................................. 12 Figure 6 - Test circuit for automotive transients .................................................................................... 12 Figure 7 - State diagram MLX80001 ..................................................................................................... 15 Figure 8 - Duty cycle calculation in accordance to LIN 2.x.................................................................... 20 Figure 9 - Duty cycle measurement in accordance to LIN 2.x for baud rates of 10.4Kbps................... 21 Figure 10 - Typical application circuitry of the MLX80001..................................................................... 22 Figure 11 - Pin description MLPQ 20 package...................................................................................... 23 MLX80001 - Datasheet 3901080001 Page 3 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 1. Functional Diagram VS Aux. Supply Vs INH Bandgap VBG TSHD Temp. Protection Vs monitor/ POR UV/POR MODE0 Mode Control Sleep timer Wake-up Control Charge pump RCO MODE1 RxDx time out fuse P0 fuse Adjustment 4 P1 fuse P2 fuse Bias P3 Slew rate Active decoupling diode Master Pull up WakeFilter VS RxD1 Rec-Filter Receiver 200K TSHD 1K TxD1 VCC Filter MR Driver control LIN1 channel1 channel2 LIN2 RxD2 TxD2 RxD3 TxD3 RxD4 TxD4 channel3 LIN3 LIN4 channel4 Figure 1 - Block diagram MLX80001 - Datasheet 3901080001 Page 4 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 2. Electrical Specification All voltages are referenced to ground (GND). Positive currents flow into the IC. The absolute maximum ratings (in accordance with IEC 60 134) given in the table below are limiting values that do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long term exposure to limiting values may effect the reliability of the device. 2.1 Operating Conditions Parameter Battery supply voltage [1] Short time battery supply voltage Low battery supply voltage Operating ambient temperature Symbol VS VS_S Vs_L Tamb Min 7 18 5 -40 Max 18 26.5 7 +125 Unit V V V C [1] Vs is the IC supply voltage including voltage drop of reverse battery protection diode, VDROP = 0.4 to 1V, VBAT_ECU voltage range is 6 to 26.5V MLX80001 - Datasheet 3901080001 Page 5 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 2.2 Absolute Maximum Ratings Parameter Battery Supply Voltage Transients at Transients at Transients at Transients at Transients at pins battery supply voltage battery supply voltage high voltage signal pins high voltage signal pins high voltage signal and power supply Symbol VS VVS.tr1 VVS.tr2 VLINx..tr1 VLINx..tr2 VHV..tr3 VLIN_DC Vlogic_DC VESDHB Human body model, equivalent to discharge 100pF with 1.5k, Human body model, equivalent to discharge 100pF with 1.5k, Tamb = +125 C Tamb = +105 C Tamb = + 95 C in free air -55 -40 Condition t < 1 min ISO 7637/2 pulse 5, t < 400ms ISO 7637/2 pulse 1[1] ISO 7637/3 pulse 2[1] ISO 7637/3 pulses 1[2] ISO 7637/3 pulses 2[2] ISO 7637/2 pulses 3A, 3B [3] t < 500ms , Vs = 18V Vs = 0V Min -0.3 -100 +50 -30 +30 -200 -22 -40 -0.3 -2 +200 +40 +7 +2 Max 30 45 Unit V V V V V V V V kV DC voltage LIN DC voltage logic I/O's ESD capability any pins ESD capability LINx Maximum latch - up free current at any Pin Maximum power dissipation [4] Thermal impedance Storage temperature Junction temperature [1] [2] [3] [4] VESDHB_HV ILATCH Ptot JA Tstg Tvj -4 -500 +4 +500 0.75 1.3 1.6 34 +150 +150 kV mA W K/W C C ISO 7637/2 test pulses are applied to VS via a reverse polarity diode and >10uF blocking capacitor. ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 100nF. ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 1nF. ISO 7637/2 test pulses are applied to VS via a reverse polarity diode and >10uF blocking capacitor Simulated values for low conductance board (JEDEC) MLX80001 - Datasheet 3901080001 Page 6 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 2.3 Static Characteristics Unless otherwise specified all values in the following tables are valid for VS = 5 to 26.5V and TAMB= -40 to 125C. All voltages are referenced to ground (GND), positive currents are flow into the IC. Parameter Undervoltage lockout Supply current single channel, dominant Supply current four channel, dominant Supply current, recessive Supply current, sleep mode Supply current, sleep mode Short circuit LIN current Pull up resistor LIN Pull up current LIN , sleep mode LIN reverse current, recessive LIN reverse current loss of battery LIN current during loss of Ground[2] Symbol PIN VS VS_UV ISd_single ISd_four ISr ISsl ISsl I_LIN_LIM R_LIN_PU MODE0/1=1, TxDx=0 VS = 26.5V, TxDx=0 no load current VS = 26.5V, TxDx=0 No load current VS = 18V, TxDx=H MODE0/1=0 VS = 12V, Tamb= 25 MODE0/1=0 PIN LINx - Transmitter VLIN = VS, TxD=0 VLIN =0, TxD open VLIN> VS, 5V < VLIN < 26.5V , 5V < VS < 26.5V, TxD open VS=0V, 0V < VLIN < 26.5V VS=12V, 0V < VLIN < 26.5V VS=18V, network load =500, TxDx = 0 VS=7V, VLIN=1.5V, TxDx = 0 TxDx open Pulse response via 1K, VPULSE = 12V, VS open PIN LINx - Receiver Receiver dominant voltage Receiver recessive voltage Center point of receiver threshold Receiver hysteresis High level input voltage Low level input voltage TxD pull up current MODE pull down resistor VilLIN VihLIN ViLIN_cnt ViLIN_hys Vih Vil -IIL_TXD RMODE_pd TxD_x =L, MODE0&1=H 10 10 VLIN_cnt = ( VilLIN_ + VihLIN )/2 VLIN_cnt = ( VihLIN -VilLIN ) 2.0 0.65 50 50 0.4 *VS 0.6 *VS 0.475 *VS 0.5 *VS 0.525 *VS 0.175 *VS V V V V V V A k 40 0.8*Vs 25 Vs 35 -150 900 -100 -75 20 20 100 2 120 200 1100 mA A A A A V mA V pF 950 25 50 2 4.5 30 2 120 4 1500 V mA mA A A A Condition Min Typ Max Unit I_LIN_PU_SLEEP VLIN=0, VS=12V, sleep mode I_LIN_rec I_LIN_LOB I_LIN_LOG VolLIN_3 I_LIN_dom_min VohLIN CLIN Transmitter dominant voltage Transmitter driving capability low battery Recessive output voltage LIN input capacitance [1] PIN TXD_x, MODE 0/1 MLX80001 - Datasheet 3901080001 Page 7 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver Parameter Low level output voltage High level output leakage High level output voltage Leakage current INH Thermal shutdown [1] Thermal recovery [1] Symbol Vol_rxd Iih_rxd Condition PIN RXD_x IRxD = 2mA VRxD = 5.5V PIN INH IINH = -180A EN = L ,VINH = 0V Thermal Protection Min Typ Max 0.9 Unit V A V -10 VS -0.8V VS -0.5V -10 160 126 +10 Voh_INH IINH_lk Tsd Thys 10 190 150 A C C [1] [2] No production test, guaranteed by design and qualification The current is determined by the master pull up, to prevent discharge battery the master pull up path will be disconnected under LOG conditions MLX80001 - Datasheet 3901080001 Page 8 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 2.4 Dynamic Characteristics Unless otherwise specified all values in the following table are valid for VS = 5 to 26.5V and TAMB= -40 to 125oC. Parameter Propagation delay receiver Propagation delay receiver [1] [1] Symbol trec_pdf trec_pdr [2] Condition CRxD =25pF falling edge CRxD =25pF rising edge Calculate ttrans_pdf ttrans_pdr LIN rising & falling edge 20kbps operation , normal mode 20kbps operation , normal mode 10.4kbs operation , low speed mode 10.4kbs operation , low speed mode 10.4kbs operation , low speed mode 10.4kbs operation , low speed mode Network < 1s Network < 1s Sleep mode LIN_x rising & falling edge MODE0/1 = L Active modes, RxD_x = L Active <--> standby mode transitions Min Typ Max 6 6 Unit s s s s Propagation delay receiver symmetry Receiver debounce time [2] LIN duty cycle 1 [3] [4] LIN duty cycle 2 [3] [4] LIN duty cycle 3 [3] [4] LIN duty cycle 4 [3] [4] trec(max) - tdom(min) trec(min) - tdom(max) Rise time in high speed mode Fall time in high speed mode Wake-up filter time Delay from Standby to Sleep Mode RxD time out MODE0/1 - debounce time trec_sym trec_deb D1 D2 D3 D4 t3 t4 tr_hs tf_hs twu tdsleep tRxD_to tMODE_deb -2 0.5 0.396 2 4 0.581 0.417 0.590 15.9 17.28 2 2 15 100 25 2 5 150 500 50 20 s s s s s ms ms s [1] [2] [3] [4] This parameter is tested by applying a square wave signal to the LIN. The minimum slew rate for the LIN rising and falling edges is 50V/us See figure 4 - receiver debounce and propagation delay See figure 5 and 6 - duty cycle measurement & calculation, Standard loads for duty cycle measurements are 1K/1nF , 660/6.8nF, 500/10nF,internal termination disabled MLX80001 - Datasheet 3901080001 Page 9 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 2.5 Timing Diagrams t < trec_deb t < trec_deb VBUS t tREC_PDF tREC_PDR VRxD 50% t Figure 2 - Receiver debouncing and propagation delay MLX80001 - Datasheet 3901080001 Page 10 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver VLINx t t > twu VINH twu t VCC_ECU t VM0/1 t VRxDx wake-up interrupt t Figure 3 - Sleep mode and wake up procedure MLX80001 - Datasheet 3901080001 Page 11 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 2.6 Test Circuits for Dynamic and Static Characteristics Figure 4 - Test circuit for dynamic characteristics Figure 5 - Test circuit for automotive transients MLX80001 - Datasheet 3901080001 Page 12 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 3. Functional Description 3.1 TxDx Input pin - Logic command to transmit on LINx bus as follows: TxD Polarity * * TxD = logic 1 (or floating) on this pin applies a recessive bus state (high bus voltage) TxD = logic 0 on this pin applies a bus dominant state depending on the transceiver mode state (low bus voltage) If the TxD pin is driven to a logic low state while the Mode 0,1 pins are in the 0,0 state or open, the transceiver does not drive the LIN pin to the dominant state. The pin contains an internal pull up to guarantee a recessive LIN behaviour in case of an open TxD pin. For 5V ECU supply systems an external pull up resistor is recommended. TxD input thresholds are standard CMOS logic levels for 3.3V and 5V supply voltages. 3.2 RxDx Output pin - Logic data as sensed on the LINx bus RxD polarity * * RxD = logic 1 on this pin indicates a bus recessive state (high bus voltage) RxD = logic 0 on this pin indicates a bus dominant state (low bus voltage) The RxDx output is a low side open drain output. An external pull up resistor is required to realize the level shift of an logic 1 level (high impedance output) to the Vcc_ECU voltage level. Wake up source recognition RxDx do not pass signals to the micro processor while in sleep mode until a valid wake up bus voltage level is received or the Mode 0,1 pins are not 0,0 respectively. When the valid wake up bus signal awakens the transceiver, the RxDx pin signalized an active low interrupt. This interrupt is active as long as no MODE pin is switched to logic 1. After the MLX80001 enters an active mode, all valid bus signals will be sent out to the RxD output. The micro can detect the source of the wake up event and start the transmission only to the network caused the wake up. RxD time out feature A dominant RxDx level longer than the specified time indicates a faulty blocked bus caused by a LIN node itself or a short circuit to ground. The master pull up resistor of the LIN channel affected by the short will be disconnected from the network in order to prevent thermal overload conditions or failure currents from the battery without any intervention from the micro. The RxD timeout will be disabled with the next L->H transition. RxD Typical Load Resistance: 2.7 k Capacitance: < 25 pF (recommended pull up resistor) (parasitic board capacitance) MLX80001 - Datasheet 3901080001 Page 13 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 3.3 Mode 0 and Mode 1 pins respectively are used to select transceiver operating modes: The MLX80001 provides a weak internal pull down current on each of these pins. In case of open pins or during the micro I/O initialisation procedure after power on or ECU wake up a stable passive behaviour of the MLX80001 is given. The MODE0/1 input thresholds are standard CMOS logic level for 3.3V and 5V supply voltages. M0 L H L H M1 L L H H Mode Sleep Mode High Speed Mode (slew rate control disabled) Low speed mode Normal Mode Mode 0 = 0, Mode 1 = 0 - Sleep mode. Transceiver is in low power state, waiting for remote wake up via LIN or by mode changes to any state other than 0,0. In this mode, the LINx pin is not in the dominant state regardless of the voltage at the TxDx pin. As long as the MODE0/1 pin are logic 0, the transceiver returns to sleep mode after power on or remote wake up after the specified time. Mode 0 = 1, Mode 1 = 0. High Speed mode This mode allows high speed data download up to 100Kbit/s. The slew rate control is disabled in this mode all the six transmission channels. The falling edge is the active driven edge, the rising edge additional is determined by the network time constant. Mode 0 = 0, Mode 1 = 1. Transmit with reduced slew rate for low speed applications with 10.4kbps or below This mode is the recommended operating mode for J2602 applications. The slew rate control of any channel is optimized for minimum radiated noise, especially in the AM band. Mode 0 = 1, Mode 1 = 1. Normal speed mode Transmission bit rate in normal mode is up to 20kbps. The slew rate control of any channel is optimized for maximum allowed bit rate in the LIN specification package 2.x. MLX80001 - Datasheet 3901080001 Page 14 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver LINx termination 1kOhm Low Slew Mode M0 low M1 high RxDx LINxdata INH VS Thermal shutdown High resistive LINx termination RxDx = low No TxDx -> LINx transmission possible M0&1=>Low High Speed Mode M0 high M1 low RxDx LINxdata INH VS VS on Normal Slew Mode M0 M1 RxDx LINxdata INH VS M0&1 =>High high high RxD L->H > 150us RxDx time out Only faulty blocked channels switched to high resistive LIN termination RxD=L > 10ms M0&1=>Low Standby M0/1 INH RxDx low M0/1 =>High (if VCC_ECU on) VS low[1] High resistive LINx termination after 200ms -> no mode change -> no valid wake up Sleep Mode M0&1 low RxDx high/ VCCECU INH floating wake up request from LINx High resistive LINx termination [1] active low interrupt, indicates source of wake up after power on all channel RxDx are active low Figure 6 - State diagram MLX80001 3.4 Power on procedure , INH Pin - INHIBIT After power on the MLX80001 automatically enters an intermediate standby mode, the INH output becomes HIGH (VBAT) and therefore the external voltage regulator will provide the Vcc supply voltage for the ECU . If there is no mode change within the time stated (typically 350ms), the IC re-enters the sleep mode and the INH output is going to become floating (logic 0). When the device detects a valid wake up condition (bus traffic on any of the four LIN networks exceeds the wake up filter time delay) the INH output becomes HIGH (VBAT) again and the same procedure starts as described after power on. In case of a mode change to any active mode the sleep timer is stopped and INH keeps HIGH(VBAT). If the transceiver enters the sleep mode (M0/1=0) , INH goes to logic 0 (floating) after typically 350 ms when no valid wake up is detected. MLX80001 - Datasheet 3901080001 Page 15 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 3.5 Pin LIN The LINx pins are the four physical interfaces to the automotive environment. The related circuitry consists of three parts: * Transmitter with slew rate control The slew rate of the transmitter is configurable by the MODE0/1 pins and depends from the application. * Receiver The receiver guarantees the specified input threshold levels and a very high robustness to external disturbances. * Termination This circuitry contains the master pull up resistor and decoupling diodes. The integrated solution allows a very comfortable control of failure situations, see description below. To guarantee the specified value of +/10% and to minimize the power dissipation, this circuitry is adjustable on wafer level. In order to allow a battery current limitation in failure situations, a high resistive termination is placed in parallel to the master pull up resistor. MLX80001 - Datasheet 3901080001 Page 16 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 4. Fail-save Features Loss of battery If the ECU is disconnected from the battery, the LIN pin is in high impedance state. There is no impact to the LIN bus traffic and to the ECU self, no damage can occur. Loss of Ground In case of an interrupted ECU ground connection the LIN pin is in high impedance state. There is no impact to the LIN bus traffic and to the ECU self, no damage can occur. Short circuit to battery The transmitter output current is limited to the specified value in case of short circuit to battery in order to protect the MLX80001 itself against high current densities. Otherwise the micro of the master ECU or the slave nodes will not detect any bus traffic until the failure disappears and will switch into sleep mode. Ground shift and short circuit to ground If the LIN wire is shorted to negative shifted ground levels, there is no current flow from the ECU ground to the LIN bus and no distortion of the LIN bus traffic. A permanent failure current from battery via LIN short to ground can be reduced dramatically by disconnection of the master pull up resistor. The following different situations may occur: * The master node is in sleep mode, there is no bus traffic at any channel. If a short circuit to ground is applied to a LIN network, the H ->L transition will awakens the shorted LIN network and the master node. Due to the wake up source recognition the master is able to detect the wake up channel and will not awaken the other LIN networks too. If there is no bus traffic possible with the shorted network, the connected nodes will go to sleep mode again and the failure current to ground is limited. If the failure disappears, the high resistive termination is able to drive a recessive voltage level and the master node and the network will wake up due to the L->H transition. * The master node is busy and there is bus traffic on one or more connected LIN networks. If a short circuit to ground is applied to a LIN network, the integrated RxD timeout circuit will disconnect the master pull up resistor from the shorted LIN network (high resistive termination present now). The failure current to ground is limited and the thermal overload condition of the MLX80001 is removed without any intervention of the micro. If the failure disappears, the RxD L->H transition will reset the RxD timer circuit and the master termination will be reconnected to the LIN network. Thermal overload The MLX80001 is protected against thermal overloads. Independent from the source of a LIN bus transmission (master channel1...4 or any slave node), the most significant part of the power dissipation will be produced in the master pull up resistor(s) during normal operation. Assuming a duty cycle of 50% and all channels are busy by bus traffic, the chip only can exceed the specified trip off temperature if the ambient temperature is higher than the specified maximum of125C. Due to failure situations such as short of a LIN channel vs. battery voltage or ground, the power dissipation can become higher than expected in the operating temperature range. In these situations any transmit path will be interrupted and any master pull up resistor will be disconnected from the LIN interfaces until thermal recovery, independent from the operating mode of the MLX80001 and without any intervention of the micro. The thermal shutdown can be detected by the micro due to the active low interrupt applied to any RxD output. Usually the short to ground situation is covered by the sleep mode behaviour or the RxD timeout feature for each channel. Thereby very high system availability is guaranteed. MLX80001 - Datasheet 3901080001 Page 17 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver Undervoltage Vs If the supply voltage is missing or will be decreased under the specified value, the transmitter is switched off to prevent undefined LIN bus traffic. If the supply voltage is in the range of Vs = 5V...7V (low battery operation), the transmitter operates in the mode as indicated by the MODE0/1 pins. Communication can not be guaranteed under all worst case conditions (plug & play specification of LIN2.x and SAE J2602 standard is defined from 7V...18V IC battery supply voltage). Overvoltage Vs If the supply voltage is in the range of Vs = 18V...26.5, the transmitter operates in the mode as indicated by the MODE0/1 pins. In case of multi channel bus traffic the power consumption can exceed the expected maximum value for the normal operation voltage range up to Vs = 18V and the thermal overload protection will operate as described above. Communication can not be guaranteed under all worst case conditions ( plug & play specification of LIN2.x and SAE J2602 standard is defined from 7V..18V IC battery supply voltage). MLX80001 - Datasheet 3901080001 Page 18 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 5. Application Hints 5.1 Bus loading requirements Parameter Operating voltage range Voltage drop of reverse protection diode Voltage drop at the serial diode in pull up path Battery shift voltage Ground shift voltage Master termination resistor Slave termination resistor Number of system nodes Total length of bus line Line capacitance Capacitance of master node Capacitance of slave node Total capacitance of the bus including slave and master capacitance Network Total Resistance Time constant of overall system Symbol VBAT VDrop_rev VSerDiode VShift_BAT VShift_GND Rmaster Rslave N LENBUS CLINE CMaster CSlave CBUS RNetwork 195 0.47 500 1 100 220 220 4 300 10 862 5 Min 8 0.4 0.4 0 0 900 20 2 1000 30 0.7 0.7 Typ Max 18 1 1 0.1 0.1 1100 60 16 40 150 m pF/m pF pF nF s Unit V V V VBAT VBAT k Table 1 - Bus loading requirements MLX80001 - Datasheet 3901080001 Page 19 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 5.2 Duty Cycle Calculation tBit tBit TxD tdom(max) VSUP 100% trec(min) 74.4% tdom(min) BUS 58.1% 42.2% 28.4% 58.1% trec(max) 28.4% VSS 0% RxD Figure 7 - Duty cycle calculation in accordance to LIN 2.x With the timing parameters shown in Figure 7 two duty cycles , based on trec(min) and trec(max) can be calculated as follows : D1 = trec(min) / (2 * tBit) D2 = trec(max) / (2 * tBit) For proper operation at 20KBit/s ( tBit = 50s) the LIN driver has to fulfill the duty cycles specified in chapter 2.4 for supply voltages of 7 to 18V and the defined standard loads . Due to this simplified definition there is no need to measure slew rates, slope times, transmitter delays and dominant voltage levels as specified in the LIN physical layer specification 1.3. The device within the D1/D2 duty cycle range operates also in applications with reduced bus speed of 10.4KBit/s or below. In order to minimize EME, the slew rates of the transmitter can be reduced (approximately by 2 times). Such devices have to fulfill the duty cycle definition D3/D4 in the LIN physical layer specification 2.x. Devices within this duty cycle range cannot operate in 20KBit/s applications. MLX80001 - Datasheet 3901080001 Page 20 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver Figure 8 - Duty cycle measurement in accordance to LIN 2.x for baud rates of 10.4Kbps With the timing parameters shown in the above diagram two duty cycles , based on trec(min) and trec(max) can be calculated as follows : tBit =96s D3 = trec(min) / (2 x tBit) D4 = trec(max) / (2 x tBit) MLX80001 - Datasheet 3901080001 Page 21 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 5.3 Application Circuitry Car Battery Cl30 1N4001 VBAT_ECU Voltage regulator LINx network 10uF 100nF VBAT INH Master ECU +5V 4 times 100nF 2.7K RxDx 4 times Rx/Tx LIN 10K VS LINx 10Ohm 47nF TxDx INH P Control LIN MODE0 MODE1 GNDx 180pF ESD protection Control CAN Rx/Tx CAN GND SWCAN TH8056 or HSCAN INH CAN 1N4001 2.2uF VBAT Voltage regulator 100nF VBAT INH Slave ECU +5V 47nF 47nF 100nF 2.7K VCC INH VS 10Ohm 180pF TxD EN GND GND ESD protection Figure 9 - Typical application circuitry of the MLX80001 MLX80001 - Datasheet 3901080001 Page 22 of 28 ECU connector to Single Wire LIN Bus P TH8082 BUS RxD ECU connector to Single Wire LIN Bus MLX80001 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 6. Pin Description RxD4 LIN4 GNDL LIN3 Vs 20 19 18 17 16 TxD4 MODE0 MODE1 GNDD TxD1 1 2 3 4 5 10 6 7 8 9 15 MLX80001 MLPQ5x 5 14 13 12 11 INH RxD3 TxD3 GNDA TxD2 RxD1 LIN1 GNDL Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Figure 10 - Pin description MLPQ 20 package Name TxD4 MODE0 MODE1 GNDD TxD1 RxD1 LIN1 GNDL LIN2 RxD2 TxD2 GNDA TxD3 RxD3 INH Vs LIN3 GNDL LIN4 RxD4 IO-Typ I I I P I O I/O P I/O O I P I O O P I/O P I/O O Transmit data to LIN4 Mode control pin Mode control pin Ground for digital core Transmit data to LIN1 Receive data from LIN1 Interface to LIN bus ,channel 1 Power ground for LIN1&2 Interface to LIN bus ,channel 1 Receive data from LIN2 Transmit data to LIN2 Ground for analogue core Transmit data to LIN3 Receive data from LIN3 LIN2 RxD2 Description Control output for voltage regulator Battery supply voltage Interface to LIN bus ,channel 3 Power ground for LIN3&4 Interface to LIN bus ,channel 4 Receive data from LIN4 MLX80001 - Datasheet 3901080001 Page 23 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 7. Mechanical Specification MLPQ5x5 20 A Min nom max 0.8 0.90 1.00 A1 0 0.02 0.05 A3 b[1] 0.25 0.30 0.35 D D2 3.00 3.15 3.25 E E2 3.00 3.15 3.25 e L 0.45 0.55 0.65 N [6][3] ND [5] NE [5] All Dimension in mm, coplanarity < 0.1 mm 0.20 5.00 5.00 0.65 20 5 5 [1] [2] [3] [4] [5] [6] Dimensions and tolerances conform to ASME Y14.5M-1994 All dimensions are in Millimeters. All angels are in degrees N is the total number of terminals Dimension b applies to metallized terminal and is measured between 0.25 and 0.30mm from terminal tip ND and NE refer to the number of terminals on each D and E side respectively Depopulation is possible in a symmetrical fashion MLX80001 - Datasheet 3901080001 Page 24 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 8. ESD/EMC Remarks * The MLX80001 is designed for automotive environments. Typical ESD - and EMC events the device can withstand are defined in chapter 2.2 `Absolute maximum ratings `. The application circuit board should be designed related to the board layout requirements in the SAE J2602 chapter 7.6.2. . The MLX80001 is an ESD sensitive device and should be handled according to guideline EN100015/ part1 (" The protection of ESD sensitive devices ") * * MLX80001 - Datasheet 3901080001 Page 25 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 9. Revision History Version 001 Changes Remark 1st Release Date March 2007 MLX80001 - Datasheet 3901080001 Page 26 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 10. Assembly Information Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD's (Surface Mount Devices) * * IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD's (Surface Mount Devices) and THD's (Through Hole Devices) * * EN60749-20 Resistance of plastic- encapsulated SMD's to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD's (Through Hole Devices) * EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD's (Surface Mount Devices) and THD's (Through Hole Devices) * EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD's is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.asp MLX80001 - Datasheet 3901080001 Page 27 of 28 March 2007 Rev 001 MLX80001 4-channel Master LIN Transceiver 11. Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis' rendering of technical or other services. (c) 2005 Melexis NV. All rights reserved. . For the latest version of this document. Go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe and Japan: Phone: +32 1367 0495 E-mail: sales_europe@melexis.com All other locations: Phone: +1 603 223 2362 E-mail: sales_usa@melexis.com ISO/TS16949 and ISO14001 Certified MLX80001 - Datasheet 3901080001 Page 28 of 28 March 2007 Rev 001 |
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